This new Mini Mirror allows the user to be able to inspect solder joints of a BGA component before and after the reflow / rework process. This will permit the operator to be able to visually inspect the outer row of solder spheres to determine proper wetting of the solder joint. The flexibility of the tool allows the user to be able to change the angle of the Mini Mirror so that the solder sphere connection to the package as well as the PCB can be seen.
The Mini Mirror's field of view is .700 inches wide. When you consider that all of these advantages are available at this price, the Mini Mirror is clearly without equal. Keep in mind that when it comes to visual inspection.
(MM-1)- The Mini Mirror at Work
Allows the operator to inspect the solder joints of BGA components before and after the rework-reflow process.